JPS501662A - - Google Patents
Info
- Publication number
- JPS501662A JPS501662A JP4972373A JP4972373A JPS501662A JP S501662 A JPS501662 A JP S501662A JP 4972373 A JP4972373 A JP 4972373A JP 4972373 A JP4972373 A JP 4972373A JP S501662 A JPS501662 A JP S501662A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4972373A JPS501662A (en]) | 1973-05-07 | 1973-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4972373A JPS501662A (en]) | 1973-05-07 | 1973-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS501662A true JPS501662A (en]) | 1975-01-09 |
Family
ID=12839093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4972373A Pending JPS501662A (en]) | 1973-05-07 | 1973-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS501662A (en]) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433665A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Manufacture for resin sealed type semiconductor device and resin sealed metal mold |
| JPS57202745A (en) * | 1981-06-05 | 1982-12-11 | Yamagata Nippon Denki Kk | Manufacture of semiconductor device |
| JPS6439740A (en) * | 1987-08-05 | 1989-02-10 | Mitsubishi Electric Corp | Resin sealer for semiconductor device |
| JPH01297225A (ja) * | 1988-05-25 | 1989-11-30 | T & K Internatl Kenkyusho:Kk | 電子部品の樹脂封止成形方法とその成形用金型 |
| JPH0231129U (en]) * | 1988-08-22 | 1990-02-27 | ||
| JP2008149677A (ja) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | 樹脂封止金型 |
-
1973
- 1973-05-07 JP JP4972373A patent/JPS501662A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433665A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Manufacture for resin sealed type semiconductor device and resin sealed metal mold |
| JPS57202745A (en) * | 1981-06-05 | 1982-12-11 | Yamagata Nippon Denki Kk | Manufacture of semiconductor device |
| JPS6439740A (en) * | 1987-08-05 | 1989-02-10 | Mitsubishi Electric Corp | Resin sealer for semiconductor device |
| JPH01297225A (ja) * | 1988-05-25 | 1989-11-30 | T & K Internatl Kenkyusho:Kk | 電子部品の樹脂封止成形方法とその成形用金型 |
| JPH0231129U (en]) * | 1988-08-22 | 1990-02-27 | ||
| JP2008149677A (ja) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | 樹脂封止金型 |